WATD Module Development Engineer

Job Title

WATD Module Development Engineer

Role Summary

Engineer responsible for development and enablement of semiconductor module and packaging manufacturing processes within the Wafer Assembly Technology Development (WATD) organization. Work includes process design, optimization, supplier collaboration, and cross-functional integration to meet performance, yield, and reliability targets for high-volume manufacturing.

Experience Level

Mid-level (experienced hire). The role expects significant hands-on experience in semiconductor process or packaging development.

Responsibilities

Core responsibilities include process development, optimization, and transfer to production.

• Drive development and enablement of packaging technologies for high-volume manufacturing and future nodes.
• Design and develop manufacturing processes: materials selection, parameter optimization, equipment metrology, and system design.
• Perform feasibility studies and pathfinding using simulation and experimental methods.
• Create and execute technology roadmaps and transition plans.
• Collaborate with equipment and material suppliers to implement enabling technologies.
• Recommend and implement equipment modifications to improve scalability and throughput.
• Use statistical process control, data analytics, and machine learning to improve process stability and yield.
• Optimize production efficiency and new product process integration with cross-functional teams.

Requirements

Must-have technical background and domain experience. Preferred qualifications describe additional strengths.

• Practical experience with development methodologies, statistical process control, and data analytics.
• Hands-on experience in wafer-level assembly, semiconductor equipment development/processing, or advanced packaging technology development.
• Demonstrated ability to lead engineering programs from strategy through production and to solve complex technical challenges.
• Experience collaborating with yield, operations, and supplier management teams.
• Preferred: experience with epoxy, mold materials, hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.

Education Requirements

One of the following is required: Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience; OR Master’s degree in those fields with 4+ years of experience; OR PhD in those fields with 2+ years of experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.