Thermal Quality and Reliability Engineer

Job Title

Thermal Quality and Reliability Engineer

Role Summary

The engineer will define and drive quality and reliability standards for semiconductor packaging components, bridging technology development and manufacturing. The role supports qualification, metrology strategy, test-equipment development, reliability modeling, and cross-functional problem resolution for packaging technologies.

This position requires hands-on evaluation of materials and processes, statistical analysis to assess risks, and collaboration with internal and external partners to meet product milestones.

Experience Level

Entry-level / College graduate. Typical experience range: 0–3 years (posting targets recent graduates and early-career engineers).

Responsibilities

Key responsibilities include:

• Develop and maintain quality and reliability standards, inspections, and testing for packaging components.
• Evaluate materials, processes, and techniques to ensure compliance with product and system requirements.
• Define metrology and measurement strategies to capture quality parameters across modules.
• Design and sustain equipment and test methods to evaluate silicon and packaging under heat, humidity, and temperature variations.
• Analyze quality and wearout reliability data to identify risk areas and recommend process improvements.
• Create reliability models and perform statistical analyses to classify failure impacts and assess specification risk.
• Develop acceleration techniques, analytical tools, and quality screens for early issue detection.
• Standardize product qualification and manufacturing quality systems to enable continuous improvement.
• Collaborate with cross-functional teams and external partners to mature packaging processes and reduce risk.
• Respond to quality excursions, troubleshoot failures, and provide corrective and preventive recommendations.

Requirements

Must-have skills and experience:

• Practical experience in semiconductor packaging and assembly processes and familiarity with common failure modes and mechanisms.
• Experience performing statistical analysis and building or using reliability models.
• Experience defining metrology strategies and developing or using test equipment for environmental and mechanical evaluation.
• Strong problem-solving skills and experience working in cross-functional teams to resolve quality issues.

Nice-to-have:

• Knowledge of design of experiments (DOE) and statistical process control.
• Experience with package technologies (e.g., BGA, wafer-level processes) and advanced analytical lab techniques (acoustic imaging, SEM, EDX, FTIR, mechanical testing).
• Programming or scripting for data analysis (Python, SQL, or similar).
• Familiarity with structured problem-solving methods (8D, 5 Whys) and experience leading cross-functional efforts.

Education Requirements

PhD in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field; the posting specifies at least 6 months of experience in semiconductor packaging and assembly processes. Related technical degrees are acceptable per the listing.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.