Technical Intern, IC Package PCB Layout Engineer

Role Summary

The Technical Intern will be part of the Package and Systems Engineering Team, focusing on substrate layout for high-performance semiconductor IC packaging solutions. This role involves collaboration with teams to enhance signal characteristics, optimize routing, and engage with experienced engineers in the design process.

Experience Level

Internship level; preferably for 4th-year students pursuing a Bachelor's Degree in relevant engineering fields.

Responsibilities

Key responsibilities include:

• Understanding physical connectivity from silicon to end user levels.
• Performing component placement and Multi-Layer HDI PCB signal and power routing.
• Collaborating with engineers to optimize routing paths.
• Contributing to the design and verification processes.

Requirements

Must-have qualifications include:

• Basic knowledge of electric circuits/electronics and electromagnetic field theory.
• Familiarity with signal integrity concepts and power delivery.
• Experience with hardware projects (Circuit/PCB design) preferred.
• Good communication skills in English and Vietnamese.
• Knowledge of Allegro PCB Design tools is advantageous.

Education Requirements

Candidates must be pursuing a Bachelor’s Degree in Electrical & Electronic Engineering, Computer Engineering, or equivalent.

About the Company

Company: Ampere

Headquarters: Ho Chi Minh City, Vietnam

Ampere is a semiconductor design company leading the future of computing with a focus on high-performance, energy efficient AI compute. As part of the Softbank Group, Ampere drives sustainable computing for AI, Cloud, and edge applications.