Substrate Packaging Research and Development Engineer

Job Title

Substrate Packaging Research and Development Engineer

Role Summary

As a Packaging Module Development Engineer in Substrate Packaging Technology Development (SPTD), you will develop and optimize substrate packaging processes, materials, and equipment for high-volume semiconductor manufacturing. You will collaborate with cross-functional teams to improve quality, reliability, and productivity for next-generation packaging solutions.

Experience Level

Mid-level; requires at least 1 year of relevant engineering experience in process development, materials, or data-driven experimentation.

Responsibilities

The role focuses on process development, experimental characterization, and sustaining operations in high-volume manufacturing.

• Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets.
• Design and implement process specifications, workflows, and equipment configurations for new technologies.
• Plan and execute design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry.
• Perform statistical data analysis and apply statistical process control (SPC) to improve process capability and stability.
• Drive continuous improvement initiatives to enhance productivity, yield, and process stability.
• Collaborate with cross-functional teams and suppliers to resolve technical challenges and define material specifications.
• Document process advancements and innovations through technical reports and white papers.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.

Requirements

Must-have technical skills, experience, and behaviors for initial consideration.

• At least 1+ year experience applying engineering judgment and data analysis to draw conclusions, build models, and design experiments.
• Hands-on experience in materials science and engineering and material characterization techniques.
• Practical knowledge of DOE, statistical data analysis, and statistical process control (SPC).
• Experience in or exposure to high-volume manufacturing processes preferred.
• Strong collaboration, ownership, and problem-solving skills; able to work under pressure and manage competing priorities.
• Effective communication skills for aligning stakeholders and resolving conflicts using data.

Nice-to-have:

• Working knowledge or prior experience with optics, lasers, laser micro-machining, or micro-fabrication.

Education Requirements

PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a closely related engineering/technical field; requires at least 1 year of related experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.