Substrate Packaging Research and Development Engineer
The engineer will own and optimize high-volume substrate packaging equipment and processes to meet safety, quality, cost, and productivity targets. The role supports factory ramps, equipment installation/qualification, and technology transfer across sites while collaborating with cross-functional teams and equipment suppliers.
This is an on-site manufacturing role focused on process and equipment improvements in semiconductor packaging for high-volume production.
Mid-level (Experienced Hire). The posting specifies a requirement of 3+ years of relevant experience in combination with graduate-level education or an equivalent doctoral degree.
Primary responsibilities include owning equipment/process performance, driving improvements, and supporting manufacturing ramps and transfers.
Must-have and desirable technical skills and experience (education requirements are listed separately below).
Minimum: Master’s degree in Chemical Engineering, Materials Science, Chemistry, Physics, or another STEM-related field plus 3+ years of relevant experience; OR PhD in Chemical Engineering, Materials Science, Chemistry, Physics, or another STEM-related field. No specific certifications are listed.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
