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Substrate Packaging Research and Development Engineer

Intel Corporation
April 30, 2026
Full-time
On-site
Phoenix, Arizona, United States
$103,730 - $198,820 USD yearly
Process Engineering Jobs, Level - Mid-Career

Job Title

Substrate Packaging Research and Development Engineer

Role Summary

The engineer will own and optimize high-volume substrate packaging equipment and processes to meet safety, quality, cost, and productivity targets. The role supports factory ramps, equipment installation/qualification, and technology transfer across sites while collaborating with cross-functional teams and equipment suppliers.

This is an on-site manufacturing role focused on process and equipment improvements in semiconductor packaging for high-volume production.

Experience Level

Mid-level (Experienced Hire). The posting specifies a requirement of 3+ years of relevant experience in combination with graduate-level education or an equivalent doctoral degree.

Responsibilities

Primary responsibilities include owning equipment/process performance, driving improvements, and supporting manufacturing ramps and transfers.

  • Own and optimize high-volume manufacturing equipment and processes to meet safety, quality, and cost objectives.
  • Perform tests and measurements to control critical dimensions and assess defectivity.
  • Recommend and implement process and equipment modifications to improve production efficiency and yield.
  • Manage maintenance, repair, and qualification activities for equipment and module components.
  • Lead continuous improvement projects focused on safety, quality, cost, productivity, defect reduction, and yield enhancement.
  • Collaborate with equipment suppliers to resolve technical issues and improve performance.
  • Develop and optimize excursion prevention and process control systems.
  • Oversee equipment installation, conversion, and qualification during factory ramps; train teams and audit technology transfers to other sites.

Requirements

Must-have and desirable technical skills and experience (education requirements are listed separately below).

  • Must-have: Familiarity with Design of Experiments (DOE) principles.
  • Must-have: Experience with structured problem-solving methodologies.
  • Nice-to-have: Expertise in statistical process control and process characterization techniques.
  • Nice-to-have: Experience in liquid chemistry and/or lithography process development.
  • Nice-to-have: Equipment development and semiconductor manufacturing process control experience.
  • Nice-to-have: Applied material science knowledge for semiconductor manufacturing and prior high-volume process development experience.
  • Nice-to-have: Experience leading group problem-solving initiatives and working across diverse technical teams.

Education Requirements

Minimum: Master’s degree in Chemical Engineering, Materials Science, Chemistry, Physics, or another STEM-related field plus 3+ years of relevant experience; OR PhD in Chemical Engineering, Materials Science, Chemistry, Physics, or another STEM-related field. No specific certifications are listed.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-04-28