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Senior Staff Engineer, Advanced Packaging Technology Development (TD)

Marvell Technology
April 30, 2026
Full-time
On-site
Chandler, Arizona, United States
$142,700 - $211,230 USD yearly
Process Engineering Jobs, Level - Senior
Senior Staff Engineer, Advanced Packaging Technology Development (TD)

Job Title

Senior Staff Engineer, Advanced Packaging Technology Development (TD)

Role Summary

Member of the Advanced Packaging Technology Development (TD) team responsible for developing and maturing advanced packaging technologies and integrating them into product platforms for high-performance computing, AI, and networking. Works with internal design teams and external manufacturing and supplier partners to deliver production-ready, manufacturable package solutions.

Experience Level

Senior — Bachelor’s degree with 10+ years of relevant experience, or Master’s/PhD with 8+ years.

Responsibilities

Primary responsibilities include technology development, architecture definition, manufacturability, prototyping, qualification, and cross-functional program leadership.

  • Develop and mature advanced packaging technologies from concept to production-ready solutions.
  • Drive integration of new packaging technologies into product platforms, ensuring alignment with system requirements and manufacturing constraints.
  • Define package architectures (chiplet topology, interconnect strategy, interposer/substrate design, power delivery networks) and lead silicon-package-system co-design.
  • Establish and refine design rules, stack-ups, and methodologies to scale interconnect density and substrate capability.
  • Work with OSATs, foundries, and substrate suppliers to resolve manufacturability, yield, and cost challenges and enable high-volume manufacturing ramps.
  • Lead prototype/test vehicle development, package qualification, reliability validation, and failure analysis.
  • Lead cross-functional efforts across design, product engineering, and supply chain and influence supplier roadmaps.

Requirements

Must-have technical skills and experience.

  • Deep expertise in advanced packaging technologies such as 2.5D/3D integration, chiplets, interposers, and advanced substrates.
  • Experience with materials, process integration, and manufacturability coordination with suppliers and OSATs.
  • Knowledge of reliability (component and board level), warpage control, and thermal management.
  • Strong electrical engineering foundation: signal integrity (SI), power integrity (PI), electromagnetic behavior, high-speed interfaces, and complex PDNs.
  • Proven record in technology development and productization, including production ramp and HVM experience.
  • Experience leading prototype development, qualification, failure analysis, and cross-functional technical programs.

Education Requirements

Bachelor’s degree with 10+ years of relevant experience, or Master’s or PhD with 8+ years of relevant experience in Electrical Engineering, Materials, Physics, Computer Engineering, or related technical fields.


About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.

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Date Posted: 2026-04-29