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Staff/Sr Staff Product Package Engineer

Renesas
August 16, 2026
Full-time
On-site
Bayan Lepas, Malaysia
Process Engineering Jobs, Level - Senior

Job Title

Staff/Sr Staff Product Package Engineer

Role Summary

Responsible for sustaining engineering of package and assembly for high-volume power IC and AI products. The role supports product lifecycle after mass production, ensuring manufacturability, quality, reliability and cost improvements.

Works cross-functionally with design, test, manufacturing, package, quality and external subcontractors (OSAT) to resolve production issues, drive process and package improvements, and sustain delivery.

Experience Level

Senior β€” typically 5+ years of experience in package development, assembly line introduction, or process engineering for high-volume semiconductor manufacturing.

Responsibilities

Primary duties focus on sustaining product performance and production readiness in mass production.

  • Act as product owner for multiple products through their production lifecycle.
  • Ensure mass-production assembly line readiness and manufacturing execution across internal factories and subcontractors.
  • Monitor and resolve manufacturing, package, and process issues with fabs, assembly sites and test sites.
  • Drive COGS reduction and process optimizations (yield, volume, test time, failure rate).
  • Improve and standardize test processes and prevent quality excursions.
  • Manage and mitigate risks via MRB/PCRB and support product qualifications and process/material changes.
  • Coordinate across Operations, QA, Reliability, Factory and OSAT partners.

Requirements

Must-have skills and experience for this role.

  • Minimum 5 years' hands-on experience in package development, assembly line introduction, or process engineering for high-volume semiconductor production.
  • Proven execution in product ramp, BOM readiness, equipment capacity planning and process optimization.
  • Experience with CuClip thin die assembly and SPS solder attach processes.
  • Experience resolving manufacturing issues with fabs, assembly and test sites; working with OSATs.
  • Familiarity with yield improvement, test-time reduction and failure analysis.
  • Proficient with data manipulation and analysis; familiarity with JMP; knowledge of PDF Exenso is a plus.
  • Strong verbal and written English communication and cross-functional collaboration skills.
  • Onsite presence required.

Education Requirements

Bachelor's degree in Engineering (Mechanical, Electrical/Electronic), Physics, Materials or a related technical field.


About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.

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Date Posted: 2026-07-29