Staff RF Module Design Engineer

Job Title

Staff RF Module Design Engineer

Role Summary

The Staff RF Module/Packaging Design Engineer will focus on developing RF/Microwave module and packaged products. Responsibilities include designing single or multi-chip modules that incorporate GaN, GaAs, or Silicon-based MMICs using advanced packaging technologies.

Experience Level

Professional

Responsibilities

• Individual contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
• Integrate MMIC(s) into air cavity or over molded modules for innovative product solutions.
• Advanced package design using 2.5D and 3D electromagnetic simulators.
• Conduct product checkout, optimization, and design verification testing (DVT) in the test lab.
• Execute DVT analysis and present results to the internal and/or external customer.
• Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

Requirements

• Experience in integrating microwave/millimeter-wave MMIC dies into single or multichip modules.
• Expert-level user in 3D EM simulation tools such as HFSS and knowledge of ADS or Microwave Office circuit simulators.
• Ability to analyze performance tradeoffs of FEMs using various packaging types.
• Strong understanding of electromagnetic theory and RF fundamentals.
• Hands-on experience with microwave measurements and calibration methods.
• Knowledge of advanced semiconductor technologies, including GaN and GaAs.
• Strong written and oral communication skills.

Education Requirements

• BS in Electrical Engineering with 8+ years of experience, or
• MS in Electrical Engineering with 5+ years of experience, or
• PhD in Electrical Engineering with RF/Microwave focus and 2+ years of experience.