Staff Package Design Engineer (Senior) - MIS substrate / Flip-chip exposed die (Power/GaN experience required)
RenesasJob Title
Staff Package Design Engineer (Senior) - MIS substrate / Flip-chip exposed die (Power/GaN experience required)
Role Summary
Design and develop package and interconnect solutions for Power SiP/modules, wafer-level and flip-chip packaging. Lead material and process qualification, work with OSATs/CMs and cross-functional teams to resolve production issues, and support qualification and ramp-up for consumer, industrial and automotive power applications.
Experience Level
Senior — requires more than 10 years of relevant package development experience.
Responsibilities
Primary responsibilities focus on material/process selection, qualification, production transfer, and package design rule maintenance.
- Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
- Develop and run DOE with OSAT/CMs to optimize processes; establish process specifications and resolve process issues early in production.
- Work with product and reliability teams to qualify new packages and processes and address customer/internal complaints.
- Ensure smooth transition into production and implement ramp-up monitoring.
- Contribute to packaging roadmap development and maintain technical expertise in power SiP/modules, wafer-level packaging, flip-chip interconnects and panel-level packaging.
- Establish and maintain package design rules.
Requirements
Must-have technical skills and experience; education details are below.
- More than 10 years of package development experience emphasizing power SiP/modules, wafer-level and flip-chip packaging.
- Strong understanding of power SiP/modules, wafer-level/flip-chip methods, assembly process knowledge, and qualification methods.
- Experience with SPC and statistical analysis software.
- Proven ability to work with OSATs/CMs and cross-functional teams to transfer designs into production.
- Strong interpersonal, communication, analytical and presentation skills.
- Nice-to-have: knowledge of wire-bonding, multi-chip module technologies, and GaN-related packaging.
Education Requirements
Doctorate, Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, or Materials Engineering.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.
