Staff Package Design Engineer (Senior) — MIS substrate / flip-chip exposed die (Power/GaN experience required)

Job Title

Staff Package Design Engineer (Senior) — MIS substrate / flip-chip exposed die (Power/GaN experience required)

Role Summary

Design and qualify advanced semiconductor package and interconnect solutions focused on power SiP/modules, wafer-level and flip-chip technologies. Work with product, reliability, quality and operations teams to transition packages into production and resolve customer and production issues.

Role includes materials/process selection, OSAT/CM coordination, package qualification and roadmap execution for consumer, industrial and automotive power applications.

Experience Level

Senior — typically requires more than 10 years of relevant package development experience.

Responsibilities

Core responsibilities include development, qualification and production ramp of package solutions:

• Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Plan and run DOE with OSAT/CM to optimize processes; establish process specifications and monitor production quality.
• Work with product and reliability teams to qualify new packages and address internal and external customer issues.
• Ensure smooth transition into production and implement ramp-up monitoring and controls.
• Participate in packaging roadmap definition and execution; maintain technical expertise in power SiP/modules, wafer-level, flip-chip and panel-level packaging.
• Establish and maintain package design rules and qualification criteria.

Requirements

Must-have technical skills and experience; nice-to-have items indicated.

• Must-have: More than 10 years of relevant experience in package development with emphasis on power SiP/module, wafer-level and flip-chip packaging.
• Must-have: Proven experience with assembly process knowledge, qualification methods, SPC and statistical analysis tools.
• Must-have: Experience working with OSAT/CM, executing DOEs and resolving process issues during production ramp.
• Must-have: Strong interpersonal, communication, analytical and presentation skills.
• Must-have: Experience in power device packaging; experience with GaN-related packaging is a plus but treated as required for some roles.
• Nice-to-have: Knowledge of wire-bonding and multi-chip module technologies.

Education Requirements

Doctorate, Master's or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.

Company

Renesas is a global embedded semiconductor company serving automotive, industrial, infrastructure and IoT markets.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.