Staff Multi-Die (3DIC/2.5D) CAD & Methodology Engineer

Role Summary

We are seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust, scalable, and production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analysis, in close collaboration with physical design, package, PI, reliability, and EDA vendor teams.

Experience Level

Level - Senior

Responsibilities

• Develop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologies.
• Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout.
• Support die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint management.
• Work with design and packaging teams to integrate package-aware and system-aware considerations into PD flows.
• Develop and support STA methodologies for multi-die designs, including cross-die timing, constraints, and closure strategies.
• Enable power analysis, IR drop, and EM signoff flows for 2.5D and 3DIC systems.
• Define guidelines for ESD verification in advanced packaging contexts.
• Assist with tool qualification, correlation, and signoff criteria definition.
• Develop and support thermal analysis methodologies for 3DIC and 2.5D designs.
• Enable CFD/FEM-based thermal analysis to model conduction, convection, and airflow effects from die to package to system.
• Support coupled electro-thermal and Multiphysics flows, integrating power, thermal, and reliability analysis.
• Build and maintain automation, scripts, and checks to improve flow robustness, runtime, and usability.
• Develop documentation, examples, and training materials for design teams.
• Debug flow issues and provide CAD support during active design cycles.
• Work closely with physical design, package, PI, reliability, and silicon teams.
• Collaborate with EDA vendors to evaluate new tools, features, and roadmap items.

Requirements

• Strong hands-on experience with 3DIC and/or 2.5D designs.
• Familiarity with chiplet-based designs, system-in-package designs and tradeoffs involved.

Education Requirements

Relevant degree in a related field or equivalent experience.