Role Summary
This role involves overseeing technical challenges related to timing signoff and design closure within the semiconductor industry. The individual will engage with R&D and lead complex silicon chip projects, optimizing power, performance, and area (PPA) through innovative solutions.
Experience Level
6-8 years of relevant experience in the semiconductor industry, with a strong foundation in timing signoff and design closure disciplines.
Responsibilities
- Review and analyze customer and partner feedback to enhance product and solution performance.
- Collaborate with R&D to shape technical roadmaps, specifications, and validation processes.
- Diagnose, troubleshoot, and resolve complex technical issues for customer installations.
- Deploy product best practices and deliver technical training.
- Support customer project execution using Synopsys tools and solutions.
- Partner with customer technical managers and Sales to identify challenges and deliver solutions.
- Communicate product value and technical messaging to diverse audiences.
Requirements
- BS or MS in Electrical or Computer Engineering.
- Hands-on expertise with Place & Route (P&R), extraction, Static Timing Analysis (STA), and Engineering Change Order (ECO) tools.
- In-depth understanding of timing methodologies, parasitic annotation, and timing analysis for IC designs.
- Experience with physical design and optimizing PPA targets, especially on advanced technology nodes.
- Strong scripting skills in TCL, Perl, and other languages.
- Comprehensive understanding of ASIC design flow and VLSI principles.
Education Requirements
Bachelor's or Master's degree in Electrical or Computer Engineering.