Silicon Photonics Advanced Packaging Intern (Summer 2027)
GlobalFoundriesJob Title
Silicon Photonics Advanced Packaging Intern (Summer 2027)
Role Summary
Summer internship supporting development of electro-optical transceivers on GF's Photonix platform and advanced 2.5D/3D co-packaged optics. The role is hands-on and contributes to thermal, mechanical, electrical, and optical chip-package co-design to improve module performance, reliability, and manufacturability.
Experience Level
Entry-level internship (student). Designed for students currently pursuing an undergraduate or graduate degree; no professional experience required.
Responsibilities
Work with cross-functional teams to advance silicon photonics packaging from concept to production readiness.
- Support packaging design rule definition, product requirements, and manufacturability work with internal teams and OSAT partners.
- Participate in design reviews and help resolve technical, reliability, manufacturability, and yield issues.
- Develop and apply analysis or simulation models to evaluate package performance, cost, and quality; document findings and recommendations.
- Contribute to qualification and continuous improvement plans; track requirements and support transitions to production.
- Follow Environmental, Health, Safety & Security requirements and safe work practices.
Requirements
Key must-haves and useful background for success in the internship.
- Must-have: English proficiency (written and verbal); ability to work at least 40 hours per week during the internship; able to travel up to 10%.
- Must-have: Currently enrolled in an accredited degree program (see Education Requirements for fields and GPA).
- Nice-to-have: Prior internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
- Nice-to-have: Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools; knowledge of chiplets, silicon photonics, or co-packaged optics.
- Nice-to-have: Leadership experience, project management skills, strong communication and organizational skills, and interest in leveraging AI tools to improve workflows.
Education Requirements
Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related technical field through an accredited program. Must have at least a 3.0 overall GPA and be in good academic standing for the internship period.
About the Company
Company: GlobalFoundries
Headquarters: Saratoga Springs, New York, USA
GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.
