Senior Yield Engineer – Substrate & Advanced Packaging

Job Title

Senior Yield Engineer – Substrate & Advanced Packaging

Role Summary

Join the Advanced Packaging Technology and Manufacturing team to lead yield improvement and process development for substrate and advanced packaging technologies. The role focuses on data-driven identification and mitigation of yield limiters, cross-functional problem solving, and enabling successful product ramps.

This position works across design, test, and manufacturing teams to convert complex experimental and manufacturing data into reproducible actions that improve yield and manufacturability.

Experience Level

Senior. Professional experience expected (see Requirements for specific experience expectations).

Responsibilities

The primary responsibilities include process development, advanced data analysis, root-cause identification, and cross-functional collaboration to improve yield.

• Lead process development efforts across technology-node lifecycles and drive resolution of critical yield limiters.
• Perform advanced statistical analysis, machine learning, and data visualization to build process development roadmaps and yield models.
• Aggregate and analyze fabrication, defect, and electrical data to detect anomalies and recommend process improvements.
• Design and execute experiments and factory task force activities to support new product introductions and design-technology co-optimization.
• Develop tools, multivariate algorithms, and measurement recipes for high-volume data analysis and rapid feedback on product integrity.
• Conduct fault isolation and failure analysis using ATE testing, DFx tools, optical probing, circuit simulation, and emulation.
• Create dashboards and systems to enable broad access to datasets and actionable insights for stakeholders.
• Collaborate across functions and sites to ensure manufacturability and resolve yield issues prior to manufacturing ramp.

Requirements

Must-have technical skills and experience. Preferred items are identified separately.

• Minimum 5+ years of professional experience in yield, process, or manufacturing engineering in logic or substrate manufacturing (or equivalent industry experience).
• 3+ years using engineering analysis tools, data analysis techniques, and scripting (e.g., Python) to automate workflows and analyses.
• 3+ years performing large-scale data analytics, commonality analysis, and developing dashboards or data visualizations using tools such as JMP, SQL, and Python.
• Practical experience with yield analysis, process optimization, and defect mode understanding in a semiconductor manufacturing environment.
• Strong statistical, problem-solving, and engineering judgment; ability to work in ambiguous technical spaces and communicate findings clearly to cross-functional teams.
• Excellent collaboration skills and experience participating in cross-functional task forces and design-of-experiments.

Education Requirements

Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field with 5+ years of experience; OR PhD in the same fields with 3+ years of experience. Fields of study listed in the posting: Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or related technical fields.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.