Job Title
Senior Staff Project/Program Design
Role Summary
Lead cross-functional engineering and operations teams to execute New Product Introduction (NPI), cost-of-goods-sold (COGS) reduction, and capacity expansion programs for semiconductor packaging products. Ensure schedule adherence, qualification, and production ramp through coordination with design, validation, firmware, supply chain, procurement, quality, and external assembly/test partners.
Experience Level
Senior β typically requires 8+ years of relevant experience in semiconductor packaging technology and product lifecycle management.
Responsibilities
Key responsibilities include:
- Lead and coordinate cross-functional teams (Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, Quality, OSAT) for NPI and program execution.
- Plan and manage NPI, COGS reduction, and capacity expansion schedules; track progress and implement data-driven mitigation plans.
- Drive COGS reduction programs end-to-end: impact assessment, qualification, PCN, safelaunch, production ramp, and ROI quantification.
- Coordinate wafer fab, assembly, and test activities to meet timeline, cost, and quality targets.
- Manage Engineering Build Request prioritization and conduct regular reviews with PMO and business leadership.
- Ensure sample and ramp readiness to meet customer delivery timelines; conduct Project Gate reviews and communicate risks and dependencies.
- Provide structured leadership updates on program status, risks, and mitigation plans; maintain schedules and qualification documentation.
Requirements
Must-have skills and experience; concise list of essentials and desirable items.
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Must-have: 8+ years of experience in semiconductor packaging technology and product lifecycle management.
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Must-have: Strong understanding of packaging manufacturing flows, package architectures, development and production processes.
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Must-have: Proven ability to lead complex, cross-functional programs and manage stakeholders across engineering, operations, supply chain, and external OSAT partners.
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Must-have: Foundational program/project management knowledge (coursework, certification, or equivalent practical experience); proficient with Microsoft Office and project management tools.
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Must-have: Strong analytical, organizational, problem-solving, time-management, and communication skills.
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Nice-to-have: Prior hands-on experience at an assembly site as a process or integration engineer.
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Nice-to-have: Experience driving capacity expansion across manufacturing sites.
Education Requirements
Bachelor's or Master's degree in Electrical Engineering is required. Program/Project Management coursework or certification (or equivalent practical experience) is recognized for foundational program management knowledge.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.

Date Posted: 2026-05-13