Senior Staff Package Design Engineer - MIS substrate / Flip‑Chip exposed die (Power/GaN experience required)
RenesasJob Title
Senior Staff Package Design Engineer - MIS substrate / Flip‑Chip exposed die (Power/GaN experience required)
Role Summary
Design and qualify advanced package and interconnect solutions for power SiP/modules, wafer‑level and flip‑chip packaging, multi‑chip modules, and power device packages. Lead material/process selection, vendor qualification, and production ramp for packages used in consumer, industrial, and automotive power applications.
Work cross‑functionally with OSATs/CMs, Product, Reliability, Quality, Marketing and Operations to ensure timely qualification, manufacturing transfer, and resolution of process or quality issues.
Experience Level
Senior — requires more than 10 years of relevant package development experience.
Responsibilities
Primary responsibilities include:
- Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
- Develop and run DOE with OSAT/CM to optimize processes; establish process specifications and monitor production quality.
- Qualify new package designs and processes with Product and Reliability teams; address internal and external customer complaints.
- Manage production transfer and ramp‑up monitoring to ensure stable manufacturing and quality.
- Contribute to packaging roadmap development and maintain expertise in power SiP/modules, wafer‑level/flip‑chip and panel‑level packaging technologies.
- Establish and maintain package design rules.
Requirements
Must‑have qualifications and skills:
- Over 10 years of hands‑on experience in package development with emphasis on power SiP/module, wafer‑level and flip‑chip packaging.
- Strong understanding of assembly processes, qualification methods, and manufacturing ramp practices.
- Experience with SPC and statistical analysis software.
- Proven ability to work with OSATs/CMs and cross‑functional teams (Product, Reliability, Quality, Operations).
- Strong interpersonal, communication, analytical, and presentation skills.
- Nice to have: experience with GaN‑related packaging; knowledge of wire‑bonding and multi‑chip module technologies.
Education Requirements
Doctorate, Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.
