Senior/Staff Engineer, Product Engineering — Media Health Manufacturing (HIG-HBM)

Job Title

Senior/Staff Engineer, Product Engineering — Media Health Manufacturing (HIG-HBM)

Role Summary

Lead a High Bandwidth Memory (HBM) Product Engineering Media Health team focused on intrinsic and extrinsic reliability for DRAM, interface die, and stacked HBM products. Own reliability test development, qualification execution, root-cause resolution, and manufacturing test-flow optimization to meet quality, cost, and cycle-time KPIs.

Experience Level

Senior. Role expects substantial experience in product/reliability engineering and team leadership.

Responsibilities

The role combines technical leadership, test development, and cross-functional program management:

• Define and develop reliability stress tests, test flows, and qualification test plans covering product reliability aspects.
• Coordinate qualification planning and execution with Global Quality; resolve gating issues.
• Drive reduction of extrinsic (Time 0 and Field) DPM and improve intrinsic reliability via optimized manufacturing test strategy.
• Lead root-cause analysis of qualification and RMA failures using electrical and physical failure analysis; implement corrective actions.
• Provide recommendations for front-end process conversions to improve yield, cost, and reliability; work with Fab, Technology Development, and Quality teams.
• Manage risk communication with product leads and make technical prioritization decisions.
• Mentor and develop team members; build project management capabilities within the team.
• Collaborate across Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability functions.
• Promote continuous improvement and evaluate AI-enabled enhancements where applicable.

Requirements

Must-have technical and leadership qualifications; preferred attributes noted where applicable.

• Must-have: Strong leadership and people-management experience; proven ability to lead technical programs and cross-functional teams.
• Must-have: Deep problem-solving skills with root-cause analysis and circuit-level understanding for reliability failures.
• Must-have: Experience with reliability test development, qualification execution, and manufacturing test-flow optimization.
• Must-have: Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) processes.
• Must-have: Good knowledge of statistics, data analysis tools, and scripting for data-driven decision making.
• Must-have: Excellent communication and presentation skills; accountable and professional work ethic.
• Nice-to-have: Prior product engineering experience with HBM or DRAM technologies.
• Other: Willingness to work on site in Singapore and travel internationally to the US, Taiwan, and Japan as needed.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering or a related technical field is required (as stated). Product engineering experience is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.