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Senior Photonic-Integrated Circuit Integration Engineer

Intel Corporation
August 17, 2026
Full-time
On-site
Santa Clara, California, United States
$190,610 - $311,890 USD yearly
ASIC Design Jobs, Level - Senior

Job Title

Senior Photonic-Integrated Circuit Integration Engineer

Role Summary

Design, simulate, validate, and drive high-volume manufacturing (HVM) for silicon photonic integrated circuits (PICs). Work with cross-functional teams including foundries, validation, manufacturing, and reliability to deliver production-ready photonic solutions for datacenter and pluggable applications.

Experience Level

Senior-level. See Education Requirements for the degree and years-of-experience combinations that define the minimum qualifications.

Responsibilities

Primary responsibilities include full-lifecycle PIC development, from architecture and design through tape-out, validation, and manufacturing enablement.

  • Architect, design, and optimize active and passive silicon photonic integrated circuits.
  • Plan and execute chip design flows: layout, tape-out, test, validation, and performance debug.
  • Simulate photonic systems using tools such as Lumerical Interconnect, ADS, or equivalent numerical solvers.
  • Collaborate with foundries, validation, manufacturing, and quality/reliability teams to enable HVM.
  • Analyze test data, perform reliability and qualification activities, and deliver known-good-die solutions.
  • Develop technical documentation, test content, and manufacturing enablement materials.

Requirements

Must-have technical skills and experience relevant to PIC integration and production.

  • Proven experience developing photonic-integrated-circuits from concept to high-volume manufacturing.
  • Design, simulation, and testing of complex PICs, including link budget, electrical power budgets, back-reflection analysis, and Monte Carlo modeling.
  • Hands-on experience with optical design and numerical simulation tools (examples: Lumerical FDTD/MODE/DEVICE/Interconnect, RSoft, Tidy3D) or Matlab/Python for modeling and analysis.
  • Experience contributing to or leading PIC tape-outs and production ramp activities.
  • Familiarity with layout and EDA tools such as Cadence, KLayout, Synopsys OptoCompiler, or GDSFactory; awareness of LVS, SDL, and DRC flows.
  • Exposure to photonic test equipment and methodologies (optical spectrum analyzers, tunable lasers, OBAs, OVAs, fiber/free-space coupling) and statistical data analysis tools (JMP, Matlab, Python libraries).
  • Ability to collaborate across engineering, manufacturing, and quality teams and produce technical documentation for HVM.

Education Requirements

Master's degree in a relevant field plus 8+ years of industry experience, OR a PhD plus 6+ years of industry experience. Relevant experience may be obtained through a combination of degree work, research, prior industry roles, or internships.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-08-17