Senior Packaging Technical Engineer - Hardware
The Senior Packaging Technical Engineer will define chip pad rings, substrate interconnect schemes, and lead package layout design for high-performance GPU hardware. The role partners with circuit, signal integrity, RTL, place-and-route, substrate layout and system-design teams to deliver robust electrical packages.
Work focuses on electrical package layout, ball-out, and collaboration to meet power, signal integrity, and manufacturability targets.
Senior-level. The posting specifies a minimum of 5+ years of board or system design experience.
Primary responsibilities include:
Summary of must-have and preferred qualifications.
Bachelor of Science in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
