Senior Engineer, HIG HBM Package PE

Job Title

Senior Engineer, HIG HBM Package PE

Role Summary

Lead the HIG HBM Package Product Engineering (PE) function to sustain and improve next-generation HBM products after design transfer into high-volume manufacturing. The role manages a global team of product engineers and partners with design, process, test, reliability, and manufacturing to drive quality, cost, cycle time and scale.

Experience Level

Senior — requires 8+ years of experience in the semiconductor industry, with product engineering and packaging experience preferred.

Responsibilities

Accountable for sustaining and improving HBM assembly and wafer-assembly yields, leading a global PE team, and delivering cross-functional technical programs.

• Own production support engineering for HBM package products and drive yield and quality improvements.
• Reduce field DPM and inline fallout by improving assembly coverage and test strategies.
• Drive wafer-assembly yield improvements through optimized test coverage and collaboration with technology and packaging teams.
• Lead cumulative yield ownership and coordinate cross-functional yield improvement initiatives.
• Manage qualification, packaging-related RMAs, and packaging reliability issues.
• Plan and execute front-end and back-end process conversions to ensure robust manufacturing performance.
• Use statistical analysis and in-house tools (including ML/AI) to analyze engineering data and implement improvements in disposition workflows.
• Define and deploy deviation/alert systems for yield loss, parametric trends, and wafer/die/cube shading.
• Mentor and develop team members and promote innovation to maintain technical advantage.

Requirements

Must-have technical background and leadership experience relevant to packaging and product engineering.

• 8+ years of experience in the semiconductor industry focused on product engineering, packaging, manufacturing or related functions.
• Proven leadership experience managing technical teams and programs.
• Demonstrated ability to work cross-functionally with fab, technology development, design, system and quality/reliability teams.
• Experience in yield and DPM reduction activities, failure analysis, and disposition processes.
• Skilled in data analysis and familiar with applying statistical methods and ML/AI tools to engineering problems.
• Strong problem-solving, accountability, communication, and collaboration skills; adaptable in a dynamic environment.
• Nice-to-have: Prior Micron experience and hands-on packaging/Product Engineering experience with HBM products.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering (or related technical field) is stated as the preferred education. The posting allows equivalent practical experience; the role also specifies 8+ years of semiconductor industry experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.