Job Title
Semiconductor Operations - SiP Productization
Role Summary
Join Semiconductor Operations to lead productization and high-volume manufacturing readiness for advanced system-in-package (SiP) and module technologies. The role drives NPI execution, supplier readiness, qualification, and quality improvement across suppliers and internal engineering teams.
This position works closely with component/module suppliers, OSATs, PCB/substrate vendors, and system integration sites, and interfaces regularly with engineering, reliability, operations, and quality teams.
Experience Level
Mid-level β requires 5+ years of relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high-volume manufacturing.
Responsibilities
Contribute to product and process development, supplier readiness, and manufacturing quality for advanced SiP and module technologies.
- Deliver high-density, high-performance SiP/module technologies that meet thermal, mechanical, performance, reliability, quality, cost, and form-factor targets.
- Support design rules, process bring-up, and materials/process selection for advanced component SiP and system integration development.
- Drive vendor factory readiness for development builds, risk ramp, and mass production through audits, build-exit criteria, and qualification activities.
- Resolve process, yield, reliability, and quality issues across product and manufacturing processes.
- Use data analysis and failure analysis to identify gaps in component design, package architecture, process capability, inspection coverage, and test readiness.
- Ensure suppliers comply with Apple specifications and manufacturing requirements; coordinate qualification and reliability activities at suppliers.
- Partner with design, hardware engineering, reliability, FEA/simulation, operations, and quality teams; provide routine status reporting and escalate issues as needed.
Requirements
Must-have qualifications and technical skills required for the role.
Must-have:
- Strong hands-on experience in SiP, semiconductor packaging, module assembly, or advanced packaging, including assembly processes, materials, substrates, and package-level failure mechanisms.
- 5+ years of relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high-volume manufacturing.
- Familiarity with SPC, DOE, FMEA and data-analysis tools (e.g., JMP) and factory quality metrics for monitoring production performance.
- Solid understanding of reliability testing and failure mechanisms (examples: temperature cycling, board-level reliability, MSL, bHAST, CAF, warpage, solder fatigue, substrate/material interactions).
- Strong interpersonal and cross-functional collaboration skills to work with design, development, operations, reliability, quality, and supplier engineering teams.
Nice-to-have:
- Experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
- Proven ability to take advanced packages or modules from concept and development builds to high-volume manufacturing.
- Experience with RF, mmWave, antenna modules, wireless modules, high-density packages, or advanced SiP architectures.
- Ability to communicate technical risk clearly, drive issue closure, and present concise executive-level updates.
- Self-motivated with demonstrated ability to lead complex issues across global suppliers.
Education Requirements
MS or BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline.
About the Company
Company: Apple
Headquarters: Cupertino, California, United States
Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.

Date Posted: 2026-05-27