R&D Engineer

Job Title

R&D Engineer

Role Summary

Technical lead responsible for advanced packaging, multi-chip assembly, and system-level integration for high-performance computing and AI modules. Works across internal IC design/validation teams and external foundry and OSAT partners to drive technology from R&D through product introduction and transfer to high-volume manufacturing.

Experience Level

Senior-level; expects experienced candidates with roughly 12–15+ years in semiconductor process technology, advanced packaging, R&D and integration roles.

Responsibilities

The role leads technology definition, development, qualification, and risk mitigation for advanced packaging and multi-chip modules.

• Lead technical development and pathfinding for multi-chip semiconductor assembly and system-level modules.
• Define technology requirements, roadmaps, evaluation and qualification plans.
• Drive development from process R&D through product development and new product introduction.
• Provide hands-on applications support and design/product enablement during technology transitions.
• Serve as principal investigator on new technology projects and coordinate external collaborators (foundries, OSATs).
• Manage projects independently from concept to transfer to high-volume manufacturing.
• Perform risk assessment and coordinate cross-functional risk mitigation across multiple projects.
• Analyze parametric and yield data to identify and resolve manufacturing issues.

Requirements

Key technical skills and practical experience required for effective performance in this role.

• Broad knowledge of advanced packaging, assembly technologies, and silicon process manufacturing.
• Experience with manufacturability and reliability issues in system-in-package assemblies.
• Experience with serial and parallel interface design for chip-to-chip and external module communication.
• Proficiency with parametric and yield data analysis and statistical analysis tools.
• Experience with root-cause tools and failure analysis (EFA, PFA) and with thermal and stress simulation tools.
• Proven ability to collaborate with external foundry R&D and OSAT partners and to communicate across engineering teams.
• Strong problem-solving, data-analysis, and interpersonal skills.

Nice-to-have:

• Experience with electrical and optical communication within modules, thermal solutions, and power-delivery design.

Education Requirements

Required: MSEE in Electrical Engineering or related field with 15+ years of relevant experience, or PhD with 12+ years of relevant experience in semiconductor process technology, advanced packaging, R&D, and integration roles.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.