Quantum Packaging Thermal Architect
Intel CorporationJob Title
Quantum Packaging Thermal Architect
Role Summary
Join Intel's Quantum Computing Group to perform thermal modeling and simulation for quantum packaging solutions, supporting integration from silicon redistribution layers to IC substrates. You will work with multidisciplinary teams to define heat spreaders, optimize thermal designs, and deliver technical documentation and presentations.
Experience Level
Mid-level - typically 5+ years of relevant industry experience in thermal modeling and packaging.
Responsibilities
Primary responsibilities focus on thermal analysis, design integration, and stakeholder communication.
- Develop and run thermal models and simulations for packaging hardware to predict heat flow from silicon test chips through heat spreaders and substrates.
- Integrate packaging hardware designs and enable co-design across electrical, mechanical, and packaging stakeholders.
- Collaborate with mechanical designers to define and optimize heat spreader solutions.
- Document and present design milestones, simulation results, and recommendations to technical and non-technical audiences.
- Maintain awareness of developments in packaging and thermal design techniques through literature and conferences.
Requirements
Must-have technical skills and professional qualities.
- 5+ years of hands-on experience in thermal modeling and simulation for packaging or equivalent industry experience.
- Proficiency with thermal/mechanical simulation tools such as Ansys Icepak, COMSOL, or equivalent.
- Practical understanding of packaging technologies and thermal integration for ICs.
- Strong analytical and problem-solving skills; ability to validate and optimize thermal designs.
- Effective communicator for both technical and non-technical audiences; experience preparing presentations and technical documentation.
- Ability to work collaboratively across diverse engineering teams in a fast-paced research environment.
- Nice-to-have: experience with cryogenic thermal/mechanical packaging modeling and simulation (2+ years preferred).
Education Requirements
Minimum: M.S. in Electrical Engineering, Physics, or a related field with 5+ years of relevant experience; OR Ph.D. in Electrical Engineering, Physics, or a related field. Related academic coursework, research, or equivalent practical experience may be considered.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
