Quantum IC Package Substrate Design Engineer
Intel CorporationJob Title
Quantum IC Package Substrate Design Engineer
Role Summary
Design large form-factor IC substrates for silicon quantum-dot processors as part of Intel's Quantum Computing Group. The role works within a multidisciplinary team responsible for substrate layout, validation, and integration with silicon, SI/PI, thermal, and system integration stakeholders.
Work focuses on substrate/package layout, design verification, and tapeout coordination to support scalable quantum systems.
Experience Level
Mid-level. Typical experience expectation: M.S. + 3+ years in IC substrate design or B.S. + 5+ years in IC substrate design (see Education Requirements for details).
Responsibilities
Primary responsibilities include substrate layout, design validation, and collaboration with cross-functional teams.
- Create IC substrate layouts using Siemens Xpedition and related tools.
- Implement high-speed signal routing and power distribution for large form-factor substrates.
- Perform design validation and verification, including DRC and LVS checks.
- Integrate advanced packaging concepts (2.5D and 3D) with substrate designs.
- Coordinate tapeout activities with substrate suppliers and internal substrate teams.
- Incorporate feedback from silicon testchip, SI/PI, thermal simulation, and system integration engineering teams.
- Document designs and present design milestones to stakeholders.
- Stay current with packaging technology and apply best practices to substrate layouts.
Requirements
Must-have technical skills and professional capabilities. Preferred items listed separately.
- Hands-on experience with Siemens Xpedition design environment and workflows.
- Proven experience in high-speed signal routing on large form-factor IC substrates.
- Experience with design validation/verification workflows, including DRC and LVS.
- Experience integrating advanced packaging (2.5D/3D) concepts into substrate designs.
- Practical experience coordinating tapeout with substrate suppliers and internal teams.
- Ability to work with SI, PI, and thermal engineering inputs and incorporate those constraints into layouts.
- Strong communication and presentation skills for technical and non-technical audiences; collaborative mindset.
- Analytical problem-solving skills and adaptability in a research-oriented environment.
- Nice-to-have: experience with advanced routing engines (AI or physics/model-based) and thermal/SI/PI simulation tools.
Education Requirements
Minimum: B.S. in Electrical Engineering, Computer Engineering, or a related field plus 5+ years of IC substrate design experience, OR M.S. in Electrical Engineering, Computer Engineering, or a related field plus 3+ years of IC substrate design experience. Qualifications may be met through a combination of industry experience, internships, coursework, or research. No specific certifications were listed.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
