Process Integration Engineer (APTD)

Job Title

Process Integration Engineer (APTD)

Role Summary

Work within Micron Technology's Technology Development (TD) organization to develop and enable advanced interconnect and packaging technologies and integrate them into product flows. The role partners with R&D, manufacturing, and suppliers to deliver manufacturable, qualified solutions that meet performance, cost, quality, reliability, and schedule targets.

Experience Level

Mid-level. Typical guidance: 3+ years of professional experience in the semiconductor industry. Role is open to Process Engineer Levels 4, 5, or MTS.

Responsibilities

Primary responsibilities include development, qualification, and transfer of advanced packaging and interconnect technologies into high-volume manufacturing.

• Partner with cross-functional teams and external suppliers to develop advanced packaging technologies and integration flows.
• Deliver reliable, cost-efficient packaging solutions that meet schedule and performance targets.
• Define project timelines, validation strategies, and qualification plans for new technologies.
• Lead technology transfer from development through qualification into high-volume manufacturing.
• Maintain safety, compliance, continuous improvement, and audit readiness while contributing to technology roadmaps.

Requirements

Must-have skills and experience:

• Minimum 3+ years professional experience in the semiconductor industry working in process integration, process development, advanced packaging, or related semiconductor technology domains within R&D, IDM, foundry, or OSAT environments.
• Practical experience enabling processes for manufacturability, quality, reliability, and cost at scale.
• Experience coordinating cross-functional development and launch activities with internal partners and suppliers.

Nice-to-have:

• End-to-end ownership of integration solutions from definition through high-volume manufacturing transfer.
• Hands-on experience with advanced packaging/interconnect technologies (2.5D/3DIC, wafer-level, fan-out).
• Experience with interconnect methods such as wirebond, microbump, and hybrid bonding.
• Background in memory (DRAM, NAND) and/or logic device technologies.
• Strong problem-solving using DoE, data-driven decision making, and root-cause analysis.

Education Requirements

MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field; or equivalent professional experience demonstrating senior-level technical capability.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.