Job Title
Process Engineer (Die Bond)
Role Summary
Member of the Assembly Process Engineering team supporting die-bond assembly operations. Responsible for process control, troubleshooting, qualification of materials/equipment, and leading New Product Introduction (NPI) to enable reliable mass production.
Experience Level
Mid-level β minimum 2 years of related working experience.
Responsibilities
Primary responsibilities focus on process optimization, NPI leadership, and continuous improvement to meet quality, cost and delivery targets.
- Establish, optimize and control die-bond manufacturing process conditions; implement SPC and monitor key process indicators (yield, defect trends).
- Lead NPI activities from design transfer, process setup and qualification to sample builds and ramp-up to mass production.
- Evaluate, qualify and release new materials, equipment and tooling in accordance with QMS requirements.
- Troubleshoot process and equipment issues; control non-conforming products and implement corrective/preventive actions.
- Drive yield improvement, cost reduction and productivity enhancement through continuous improvement initiatives.
- Develop and maintain process documentation, SOPs and work instructions for operations and technical staff.
- Perform structured problem-solving using tools such as FMEA, FTA and Why-Why analysis; prepare technical analyses and improvement reports.
- Support customer claim investigations, audits and technical discussions during production and NPI phases.
Requirements
Must-have technical skills and competencies; nice-to-have items listed afterwards.
- Minimum 2 years of related experience in assembly/process engineering or manufacturing.
- Strong analytical and structured problem-solving skills.
- Good communication skills and ability to work cross-functionally with Production, Quality and Engineering teams.
- Proficient in Microsoft Office (Excel, PowerPoint) for data analysis and reporting.
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Nice-to-have: Hands-on experience with die-bond machines (setup, optimization, troubleshooting) or other assembly equipment.
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Nice-to-have: Experience in NPI from development and qualification to mass-production ramp-up.
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Nice-to-have: Exposure to yield improvement, cost reduction and productivity projects; familiarity with automation, poka-yoke and smart manufacturing concepts.
Education Requirements
Bachelor's degree in Engineering (Mechanical, Electrical, Electronics, Materials, Mechatronic or related) is specified in the posting.
About the Company
Company: Renesas
Headquarters: Hitachinaka, Japan
Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.

Date Posted: 2026-04-29