Principal Mechanical Design Engineer

Job Title

Principal Mechanical Design Engineer

Role Summary

Lead mechanical and thermal design and analysis for microelectronic packaging used in defense and aerospace communications, radar, and electronic warfare products. Work within a cross-functional engineering team to develop, validate, and transfer packaging solutions into production.

Experience Level

Senior — requires substantial industry experience; the role description specifies a minimum of 12 years' experience in semiconductor packaging.

Responsibilities

The role focuses on mechanical/thermal design, analysis, and production support for packaged microelectronic assemblies.

• Lead mechanical and thermal design efforts for next-generation microelectronic packaging with emphasis on structural analysis.
• Perform detailed FEA and simulation-driven modeling and optimization at die/package/board level.
• Develop and execute thermal and mechanical stress measurement techniques to validate analyses.
• Guide package and substrate design decisions to meet performance and yield requirements.
• Respond to and supervise resolution of manufacturing and assembly issues.
• Maintain awareness of packaging technology trends across GaN, GaAs, digital and analog silicon; provide technical input for technology adoption.
• Support external customers with application models and failure analysis.

Requirements

Must-have technical skills, domain experience, and compliance requirements.

• Minimum ~12 years' experience in semiconductor packaging (defense/aerospace/avionics/automotive experience preferred).
• Expert-level proficiency with FEA tools (e.g., ANSYS) and mechanical CAD (e.g., SolidWorks) or equivalent.
• Deep knowledge of microelectronic package technologies, materials, manufacturing methods, plating, sealing, and interconnects.
• Hands-on experience with assembly processes: die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow.
• Familiarity with inspection and failure-analysis equipment and methods; reliability calculation methods for semiconductors.
• Understanding of GD&T, ANSI standards, and tolerance stack-up analysis.
• Proven ability to work with cross-functional teams and communicate technical results clearly in writing and verbally.
• This position is not eligible for visa sponsorship; applicants must be a US Person and able to work on US government contracts.

Education Requirements

Bachelor's (BSME) or Master's (MSME) degree in Mechanical Engineering or a closely related field is stated as the educational requirement. The posting specifies a minimum of 12 years' industry experience; no alternative "equivalent experience" language was provided.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.