Principal HBM Tapeout Execution & Release Coordination

Job Title

Principal HBM Tapeout Execution & Release Coordination

Role Summary

Lead tapeout execution and release coordination for High Bandwidth Memory (HBM) designs within Micron’s Heterogeneous Integration Group (HIG). Partner with design, integration, verification, product, and manufacturing teams to ensure release readiness, governance, and on-schedule delivery of complex memory programs.

Work supports next-generation AI and high-performance computing memory solutions.

Experience Level

Senior-level. Preferred 10+ years of relevant semiconductor industry experience; equivalent practical experience accepted.

Responsibilities

Coordinate tapeout and release activities to ensure design quality, completeness, and timely delivery.

• Lead tapeout execution and release coordination for HBM builds; manage schedules, DBR milestones, and release readiness.
• Prepare, review, and finalize tapeout collateral such as TOAST, RCDB, TWIT, and related documentation.
• Coordinate signoff readiness across timing, power, physical verification, integration, and other release-critical domains.
• Ensure database quality, completeness, traceability, and presence of signoff evidence prior to tapeout.
• Track and mitigate release risks, manage waivers and open items, and enforce release governance and discipline.
• Communicate status and escalate issues to program leadership to meet deadlines.

Requirements

Must-have technical experience and skills. Education items are listed separately under Education Requirements.

• Proven experience with SoC, memory, or semiconductor tapeout execution and design release processes.
• Strong knowledge of DBR processes, tapeout checklists, release governance, and signoff methodologies.
• Hands-on experience preparing or reviewing tapeout artifacts such as TOAST, RCDB, and TWIT.
• Experience managing release readiness, risk tracking, and progress in deadline-focused environments.
• Ability to coordinate cross-functional teams including design, verification, physical design, and product engineering.
• Strong analytical and problem-solving skills with attention to detail.

Nice-to-have:

• Experience with formal program or project management tools and methodologies.
• Experience with Agentic AI tools to assist design and verification.
• Extensive semiconductor industry experience (e.g., 10+ years).

Education Requirements

Bachelor's degree in Electrical Engineering or a related field, or equivalent practical experience. The posting explicitly allows equivalent experience in lieu of a degree. No specific certifications were listed.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.