Principal Engineer, HIG-HBM Design

Job Title

Principal Engineer, HIG-HBM Design

Role Summary

Design and analyze high-performance digital and analog circuits for HBM/DRAM memory products. Drive simulation, optimization, and floor-planning to meet performance, power, cost, quality, reliability, and time-to-market targets.

Work with global design, verification, test, process integration, and product teams to deliver production-ready memory devices and validation strategies.

Experience Level

Senior - requires extensive experience (posting specifies 10 years) in memory design and validation.

Responsibilities

Main responsibilities include technical design, validation, and cross-functional collaboration:

• Architect, simulate, and optimize digital and analog circuits for HBM/DRAM products, including floor planning and physical implementation constraints.
• Design and verify high-speed data-paths from I/O interfaces to core array.
• Develop and validate memory test architectures and production silicon validation processes (e.g., MBIST and system-level validation).
• Collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to support manufacturing and customer requirements.
• Drive power/energy optimization efforts, including power-domain network analysis and low-power-per-bit solutions.
• Define and apply qualification, debug, and silicon bring-up methodologies across front-end and back-end flows.

Requirements

Key technical skills and experience required (must-have unless noted):

• High-speed memory design on data paths (I/O to core array).
• Power domain network analysis and power-aware design practices.
• Memory test architectures and silicon validation experience (MBIST, production validation).
• Digital design methodology: RTL design, synthesis, and physical implementation.
• ASIC digital design development experience.
• Memory core timing, latency control, and signal-integrity considerations for advanced memory designs.
• (Nice-to-have) Experience with HBM and ML/AI-targeted memory solutions, floorplanning tools, or advanced DRAM technologies.

Education Requirements

Employer will accept a Master's degree in Electrical Engineering, Physics, Computer Engineering, Semiconductor Engineering, or a related field plus 10 years of experience in the job offered or in a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.