Principal Engineer, GaN Package Development

Job Title

Principal Engineer, GaN Package Development

Role Summary

Lead development and industrialization of advanced packaging and assembly technologies for GaN power devices and modules. Responsible for package architecture, process definition, reliability and performance targets, and transfer to high-volume manufacturing.

Work within a cross-functional team (R&D, design, production, quality, purchasing) and lead technical execution from concept to manufacturing.

Experience Level

Senior (Principal). Years of experience not specified.

Responsibilities

Accountable for technical leadership and successful deployment of GaN package solutions:

• Lead development, optimization, and implementation of GaN packaging and assembly processes.
• Define package architectures to meet performance, reliability, and cost targets.
• Collaborate with R&D, design, production, quality, and purchasing for transfer to manufacturing.
• Specify, select, and qualify equipment, materials, and tooling.
• Create and maintain process documentation, specifications, and engineering change records.
• Troubleshoot manufacturing issues and lead root cause analysis.
• Manage supplier qualification and support technology transfer for outsourced processes.
• Drive yield, quality, and continuous improvement using SPC and data-driven methods.

Requirements

Key skills and experience required or strongly preferred.

• Strong experience in semiconductor backend R&D and manufacturing, including assembly and packaging.
• Solid understanding of semiconductor backend processes and connection technologies.
• Familiarity with measurement systems, industry standards, and best practices.
• Strong analytical skills, data interpretation, root cause analysis, and Six Sigma methodologies.
• Effective communication and collaboration across functions; able to manage multiple priorities independently.
• Results-driven and quality-focused mindset.
• Nice-to-have: direct experience with GaN packaging, device characteristics, and related manufacturing challenges.

Education Requirements

Bachelor's or Master's degree in Mechanical Engineering, Microelectronics, Materials Science, Physics, or a related technical field.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.