Principal Engineer - Advanced Packaging
Marvell TechnologyJob Title
Principal Engineer - Advanced Packaging
Role Summary
Lead development and productization of advanced semiconductor packaging technologies within the Packaging Technology Development (TD) team. Drive package architecture, integration across silicon/package/system, and transfer of technologies into high-volume manufacturing.
Work cross-functionally with design, product engineering, supply chain, OSATs, foundries and substrate suppliers to ensure manufacturability, reliability, and qualification of new packaging solutions.
Experience Level
Senior — principal/lead engineer. Typical experience guidance from the posting: 8+ to 10+ years depending on degree (see Education Requirements).
Responsibilities
Main responsibilities include technology development, architecture definition, manufacturability, prototyping and program leadership.
- Develop and mature advanced packaging technologies (2.5D/3D, chiplets, interposers, advanced substrates) from concept to production readiness.
- Define package architectures, interconnect strategies, interposer/substrate designs, and power delivery network (PDN) solutions.
- Lead co-design across silicon, package and system to optimize performance, power and area.
- Establish and refine design rules, stack-ups and integration guidelines; drive scaling of interconnect density and substrate capability.
- Collaborate with OSATs, foundries and substrate suppliers to address process capability, yield, cost and ramp-to-volume requirements.
- Lead prototype/test-vehicle development, package qualification, reliability validation and failure analysis.
- Lead cross-functional programs and influence supplier roadmaps to align with product and technology needs.
Requirements
Must-have technical skills, experience, and constraints identified for the role.
- Must have: Deep expertise in advanced packaging technologies including 2.5D/3D integration, chiplets, interposers and advanced substrates.
- Must have: Knowledge of materials, process integration, manufacturability and reliability issues (warpage, thermal management, component/board-level reliability).
- Must have: Strong electrical engineering foundation: signal integrity (SI), power integrity (PI), electromagnetic behavior, high-speed interfaces and complex PDNs.
- Must have: Proven experience in technology development and productization (ramp to production), including prototype validation and qualification.
- Must have: Experience working with OSATs, foundries and substrate suppliers to resolve manufacturability and yield challenges.
- Nice to have: Prior leadership of multi-disciplinary teams and experience influencing supplier roadmaps.
- Other requirements: Ability to lead cross-functional programs and perform advanced failure analysis and reliability validation.
- Compliance: Role may require access to information subject to U.S. export control laws; candidates must be eligible for export-controlled information and may be subject to export license review.
- Location: Position based in Chandler, AZ (onsite).
Education Requirements
Bachelor's degree with 10+ years of relevant experience, or a Master's or PhD with 8+ years of relevant experience in relevant technical fields (examples in posting: electrical engineering, materials/packaging-related disciplines). Specific degree/field not strictly enumerated beyond "relevant fields."
About the Company
Company: Marvell Technology
Headquarters: Santa Clara, California, United States
Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.
