Power Integrity Engineer - Advanced Packaging

Job Title

Power Integrity Engineer - Advanced Packaging

Role Summary

Develop and validate power-delivery network (PDN) and power integrity solutions for advanced IC packages. The role sits in Central Engineering Packaging and focuses on electrical design, modeling, characterization, and manufacturability for multi-chip and high-speed package designs.

Experience Level

Mid-level. Typical guideline: 3–5 years experience with a Bachelor's degree; 1–3 years with a Master's or PhD.

Responsibilities

The engineer will drive PDN and power-integrity activities across package development phases and interface with internal teams and external partners.

• Design, model, simulate and characterize package PDN for power integrity and optimal signal delivery.
• Perform 2D/3D EM and circuit simulations to validate package electrical performance.
• Collaborate with package layout designers to ensure manufacturability and meet performance, reliability, and cost targets.
• Interface with IC designers and product/marketing to define achievable package specifications.
• Support prototype testing, measurement, and problem resolution through to production release.
• Document results and present findings to cross-functional teams.

Requirements

Must-have technical skills and experience:

• Strong fundamentals in circuits, electromagnetics, transmission lines, microwave theory, and signal & power integrity.
• Experience with 2D/3D EM and PI tools (examples: Ansys SIWave, Cadence PowerSI/PowerDC/Clarity, XtractIM, Keysight ADS).
• Frequency- and time-domain knowledge of high-speed signaling and channel behavior.
• Experience with channel simulations using MATLAB, ADS or equivalent tools.
• Power plane design, modeling and analysis for power integrity.
• Familiarity with IC package or PCB layout tools (e.g., Cadence APD, Mentor PADS, Xpedition Package Designer).
• Working knowledge of circuit simulators (e.g., Spectre, ADS, HSpice, Ansys Electronics Desktop).
• Strong communication, documentation, and teamwork skills; good English (verbal and written).

Nice-to-have:

• Experience with 2.5D/3D package development and new product introduction.
• Thermal and mechanical analysis knowledge for package development.
• Ability to automate SI/PI and packaging workflows using scripting (Python, Skill, TCL).
• Track record of taking designs from concept through production.

Education Requirements

Bachelor's degree in Electrical Engineering (typical 3–5 years relevant experience) or Master’s/PhD in Electrical Engineering (typical 1–3 years relevant experience). Field: Electrical Engineering or closely related technical discipline. No specific certifications required; equivalent practical experience in relevant domains may be considered.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.