Role Summary
The role involves leading the backend implementation of advanced Intel wireless products as a Senior Physical Design Technical Lead. This position focuses on enhancing design implementation flows, automation, and methodologies.
Experience Level
Senior level, requiring 10+ years of hands-on experience in VLSI physical design.
Responsibilities
The key responsibilities include:
- Lead the physical design flow and implementation activities for complex VLSI chips.
- Define and improve design implementation flows and automation.
- Optimize power, performance, and area (PPA) metrics.
- Analyze and resolve design issues related to place and route, timing, power, and signal integrity.
- Collaborate with other design teams for integration and optimization of design specifications.
- Mentor junior engineers and provide technical expertise.
- Interface with EDA vendors for tool and technology evaluations.
Requirements
The essential requirements include:
- BSc/MSc in electrical or computer engineering.
- 10+ years of experience in VLSI physical design.
- Excellent familiarity with physical design implementation flows including floorplanning, placement, and routing.
- Proficiency in Synopsys EDA tools, with Cadence knowledge being an advantage.
- Knowledge of scripting languages such as Python, Perl, or TCL.
- Strong understanding of STA, IR drop, EM analysis, DRC/LVS, and ECO flows.
- Experience in managing and mentoring technical teams.
- Excellent problem-solving skills and attention to detail.
- Strong communication and teamwork skills.
Education Requirements
BSc or MSc in electrical or computer engineering is required.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Based in Mexico, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-03-12