Physical Design (Backend) Engineering Team Lead

Role Summary

The Physical Design (Backend) Engineering Team Lead will lead a team of backend engineers in delivering high-performance, low-power chip designs. This role involves shaping physical implementation strategies and methodologies while ensuring optimal performance in the development of next-generation wireless products.

Experience Level

Senior; 10+ years of experience in physical design, with at least 2 years in a technical leadership role.

Responsibilities

Key responsibilities include:

• Leading the physical design team through all stages of backend implementation.
• Defining methodologies for advanced node implementation.
• Collaborating with RTL, DFT, analog, and packaging teams.
• Owning and delivering physical signoff with high quality.
• Evaluating new tools and technologies to improve productivity.
• Mentoring a team of physical design engineers.
• Interfacing with technology teams and EDA vendors.

Requirements

Essential qualifications include:

• B.Sc./M.Sc. in Electrical Engineering or related field.
• 10+ years of physical design experience.
• Successful tapeouts in advanced FinFET nodes.
• Deep understanding of physical design flows and tools (e.g., Fusion Compiler, PrimeTime).
• Strong analytical, organizational, and communication skills.

Education Requirements

B.Sc./M.Sc. in Electrical Engineering or related field.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Based in Mexico, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.