Packaging Process Development Engineer

Job Title

Packaging Process Development Engineer

Role Summary

Join Intel's Packaging Module Development team in Phoenix to develop and optimize semiconductor assembly media, collaterals, processes, and evaluation equipment. The role focuses on improving manufacturability, yield, reliability, and cost for next-generation packaging technologies.

This position requires hands-on engineering to define material specifications, design test equipment, lead problem solving, and work cross-functionally with suppliers and internal teams.

Experience Level

Entry-level / Early career. Typical guidance: 2+ years of relevant experience with a Bachelor's degree, or a Master's degree in a related STEM field.

Responsibilities

Primary responsibilities include process development, equipment design for evaluation, and qualification of media and collaterals to meet quality and reliability targets.

• Develop and optimize assembly media and collaterals for quality, reliability, cost, yield, and manufacturability.
• Apply DOE and SPC methods to improve processes and document results in technical reports.
• Design, build, and maintain equipment and fixtures to evaluate performance under temperature, humidity, mechanical stress, and dynamic conditions.
• Manage prototype manufacturability and oversee manufacturing workflows throughout their lifecycle.
• Define material specifications and coordinate with supplier quality and procurement to ensure compliance.
• Analyze failure mechanisms and establish reliability benchmarks aligned with customer requirements.
• Lead root-cause problem solving and continuous improvement initiatives.
• Standardize qualification practices and manage technical risks against product schedules and supplier deliveries.
• Provide technical consultation as a subject matter expert to internal teams and external partners.

Requirements

Must-have technical skills, plus professional and interpersonal skills needed to execute the role.

• Experience designing and reading mechanical drawings; familiarity with Geometric Dimensioning & Tolerancing (GD&T).
• Proficiency with mechanical design software such as SolidWorks or AutoCAD.
• Hands-on experience with designing or specifying test/evaluation equipment and fixtures.
• Practical experience managing manufacturing workflows and ensuring prototype manufacturability.
• Strong analytical and problem-solving skills; ability to use data to drive decisions.
• Effective verbal and written communication across technical and non-technical stakeholders.
• Collaborative mindset and ability to work cross-functionally with suppliers and internal teams.
• Nice-to-have: SPC and DOE experience, high-precision manufacturing (stamping, CNC), semiconductor packaging/process knowledge, and supply chain/materials qualification experience.

Education Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience; OR a Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field. Experience may be obtained through coursework, projects, research, internships, or relevant job experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.