Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Develop assembly processes and equipment for advanced semiconductor packaging platforms, focusing on manufacturability, reliability, yield, cost, and productivity. Work within packaging technology and manufacturing teams to qualify processes, evaluate equipment, and drive continuous improvement.

Experience Level

Mid-level. Typical experience range for this role aligns with 3–7 years of relevant engineering or manufacturing experience (see Education Requirements for specific degree/experience combinations).

Responsibilities

Key responsibilities include process and equipment development, qualification, and cross-functional support.

• Develop and optimize assembly processes and equipment to meet quality, reliability, yield, cost, and productivity targets.
• Define process and equipment specifications and execute design of experiments (DOE), statistical analysis, and data-driven process improvements.
• Design, build, and maintain test methods and equipment to simulate field-use conditions (thermal, humidity, cycling, dynamic forces) for package and silicon evaluation.
• Lead problem-solving and process-improvement efforts using experimental design and engineering analysis.
• Document technical findings, results, and best practices in technical reports and white papers.
• Collaborate with manufacturing, supplier quality, procurement, and external vendors to establish material/equipment specifications and ensure vendor performance.
• Support manufacturability reviews, process flows, procedures, and implementation for new package designs and production ramps.

Requirements

Must-have technical skills and experience; preferred items are listed separately.

• Practical experience with process development for packaging or assembly equipment.
• Experience applying DOE, statistical methods, and data analysis to process development and yield improvement.
• Knowledge of reliability testing, failure analysis, and process qualification methods.
• Experience developing or evaluating test equipment and fixtures for thermal, humidity, mechanical, or dynamic stress testing.
• Strong problem-solving, documentation, and technical communication skills.
• Ability to work cross-functionally with manufacturing, supplier quality, and procurement teams.
• Preferred: experience in semiconductor manufacturing, advanced packaging technologies, or high-volume manufacturing environments.

Education Requirements

Bachelor's, Master’s, or PhD in Mechanical, Electrical, Chemical, Materials Science, Industrial Engineering, or a related engineering/science discipline. The posting specifies degree-to-experience options: Bachelor's + 5+ years, Master's + 3+ years, or PhD + 6+ months of engineering industry experience (equivalent practical experience considered where applicable).

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.