Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Develop and optimize package assembly processes and equipment to meet quality, reliability, cost, yield and manufacturability targets for advanced packaging platforms. Partner with design, supplier, and manufacturing teams to qualify materials, equipment and processes and to ensure product readiness for production.

Contribute to equipment development, process validation, and reliability assurance for semiconductor packaging products.

Experience Level

Mid-level. Experience requirements vary by degree: Bachelor's with 6+ years, Master's with 3+ years, PhD with 6+ months (see Education Requirements).

Responsibilities

Deliver equipment and process development, validation, and continuous improvement for packaging assembly and qualification.

• Develop and optimize assembly processes and equipment to achieve quality, reliability, yield and productivity goals.
• Write equipment and process specifications and apply design of experiments and statistical analysis to improve processes.
• Design and maintain test setups to evaluate packages under simulated field conditions (thermal, humidity, mechanical).
• Define reliability requirements and influence material selection, package design, and process development based on failure-mechanism understanding.
• Establish material specifications for contract assemblers and raw-material vendors and work with supplier quality and procurement to ensure conformance.
• Develop screening methods, acceleration techniques, tools, and quality monitors to detect packaging issues early.
• Lead problem-solving, standardization of qualification methods, and documentation of improvements (white papers, reports).
• Support equipment sustaining, change-control, and respond to customer/production events as needed.

Requirements

Must-have technical skills and proven experience in packaging equipment/process development and manufacturing integration.

• Hands-on experience with equipment development, integration, or sustaining in semiconductor or related manufacturing.
• Experience selecting and integrating process equipment; preference for dispense, mold, or cure technologies.
• Practical use of DOE and SPC or similar statistical methods for process improvement and data analysis.
• Experience with reliability testing, failure analysis, and setting/meeting reliability requirements.
• Experience defining material specifications and working with suppliers and supplier-quality processes.
• Strong technical documentation skills and ability to produce clear specifications, reports, and white papers.
• Project management experience delivering results on time-critical technical programs.
• Regular onsite presence required to fulfill essential job responsibilities.

Education Requirements

Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 6+ years industry experience; OR Master's degree in those fields with 3+ years industry experience; OR PhD in those fields with 6+ months industry experience. Qualifications may also be met through a combination of relevant industry experience, internships, coursework or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.