Packaging Module Development Engineer
Intel CorporationJob Title
Packaging Module Development Engineer
Role Summary
Technical engineer responsible for process and technology development for electronic packaging assembly (solder ball attach, chip attach, deflux, component attach) within the Technology Development organization. The role focuses on developing, characterizing, qualifying and transferring materials and processes for new products and test vehicles into volume manufacturing.
Works within cross-functional teams to optimize package manufacturability, yield, reliability and cost while documenting technical results and recommendations.
Experience Level
Mid-level. Preferably ~5 years of experience in electronic packaging or process development; equivalent relevant experience will be considered.
Responsibilities
Key responsibilities include development, characterization and transfer of packaging processes and materials. Work involves experimental design, data analysis, and cross-functional collaboration.
- Develop and optimize solder ball attach, chip attach and deflux processes for new products and test vehicles.
- Design and execute experiments (DOE), analyze data and apply SPC to drive process improvements.
- Conduct material characterization and failure analysis to identify root causes and interactions.
- Qualify materials and processes and support transfer to high-volume manufacturing.
- Create process specifications, technical reports and white papers documenting improvements.
- Improve manufacturing metrics: yield, quality, reliability, cost and productivity.
- Collaborate with cross-functional teams (engineering, manufacturing, quality) to assess technology fit and performance.
- Operate under project timelines and contribute to pathfinding and ramp activities.
Requirements
Must-have technical skills and professional attributes for effective performance in this role.
- Experience in electronic packaging process development, especially Chip Attach, Deflux or Ball Attach processes.
- Practical experience with DOE, Statistical Process Control (SPC) and FMEA.
- Strong data analysis, problem solving and troubleshooting skills.
- Experience in R&D or process engineering focusing on materials and assembly processes.
- Excellent written and verbal communication and influencing skills.
- Ability to work under tight schedules and perform under pressure; proactive attitude.
Education Requirements
BEng, MEng, MSc or PhD in Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics or related engineering/technical disciplines. Research and development background is preferred.
Additional Information
On-site role based in Kulim, Malaysia (Shift 1). Intel follows equal employment and ethical hiring practices.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
