Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

The Packaging Module Development Engineer develops materials, processes, and equipment for semiconductor package and module assembly to meet quality, reliability, cost, yield and manufacturability targets. The role works on packaging platform technologies within a cross-functional foundry/manufacturing organization to enable mobile, edge, and hyperscale platforms.

This position requires regular on-site presence in the Phoenix, AZ facility and involves collaboration with supplier quality, procurement, and partner engineering groups.

Experience Level

Mid-level. Typical minimum experience aligns to: Bachelor's +6 years, Master's +4 years, or PhD (as listed in minimum qualifications).

Responsibilities

Key responsibilities include developing and qualifying materials and processes, improving manufacturability, and ensuring reliability of packaging solutions.

• Develop and optimize assembly materials, processes, and equipment for packaging/module platforms.
• Design and execute experiments and data analysis to characterize processes and improve yield, cost, and productivity.
• Create material and process specifications and document improvements through reports and white papers.
• Develop and apply materials characterization techniques, accelerated tests, and quality screens to identify reliability risks early.
• Define reliability requirements and influence package design, material selection, and process development based on failure-mechanism understanding.
• Establish material specifications for contract assemblers and vendors; work with supplier quality and procurement to enforce requirements.
• Oversee manufactured package flows and ensure manufacturability of package physical layouts.
• Provide materials expertise to resolve packaging problems and respond to customer or field events.
• Lead problem-solving and continuous improvement using experimental design and statistical methods.

Requirements

Minimum technical and professional requirements (education summarized separately below).

• Practical experience with design of experiments, statistical methods, and process characterization.
• Experience with packaging materials, assembly processes, and equipment development relevant to semiconductor technologies.
• Experience in die packaging, quality and reliability for packaging, and disciplined execution of manufacturing solutions.
• Skills in data analysis and application of statistical principles to process development.
• Knowledge of materials characterization principles and tools.
• Ability to define and set reliability requirements and translate them into material/process choices.
• Experience interacting with suppliers and driving supplier technology development (preferred).
• Hands-on semiconductor fabrication or packaging process experience and familiarity with dispense, mold, or cure equipment (preferred).
• Strong communication and influencing skills; ability to lead and coach technical teams in a matrixed environment (preferred).

Education Requirements

Minimum qualifications: Bachelor's degree in Metallurgy, Materials Science, Polymer Science, Polymer Chemistry, Physics, or Chemical Engineering with 6+ years of relevant experience; OR Master's degree in those fields with 4+ years of relevant experience; OR PhD in those fields. (These degree requirements are stated in the job's minimum qualifications.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.