Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Lead materials and process development for co-packaged optical semiconductor assemblies, focusing on materials characterization, assembly process development, and reliability for integrated optics packaging. Work across packaging architecture, module teams, suppliers, and manufacturing partners to advance technologies from pathfinding to high-volume manufacturing.

Experience Level

Mid-level. Typical background: MS + 3+ years relevant experience or PhD + 1+ years relevant experience.

Responsibilities

Primary responsibilities include experimental materials development, process integration, and cross-functional collaboration to qualify materials and assembly processes for optical packaging.

• Design and execute experiments to characterize materials and identify failure modes; analyze structure–property–performance relationships.
• Collaborate with materials suppliers to develop formulations that meet technical, quality, supply, and cost targets.
• Develop and validate assembly/materials processes and integrate them onto test vehicles and products.
• Work with equipment and process engineering teams to scale solutions toward manufacturing and assess product performance.
• Develop metrologies, tools, and quality screens to detect packaging quality or reliability issues early.
• Apply novel concepts in materials, assembly processes, or equipment to enable future packaging technologies.
• Communicate results and recommendations to cross-functional stakeholders and present technical findings.

Requirements

Must-have technical skills and behaviors; listed separately from formal degree requirements.

• Practical experience with optical materials, optical assembly processes, and active optical alignment.
• Hands-on experience in materials characterization, experimental design, and data analysis.
• Experience integrating materials and processes into semiconductor packaging or assembly workflows.
• Ability to work with suppliers and external partners to develop and qualify materials.
• Experience developing metrology, process controls, or reliability screens for packaging.
• Strong problem-solving, written and verbal communication, and cross-team collaboration skills.
• Nice-to-have: semiconductor packaging experience, optical connector/component design, photolithography materials/process experience, ceramics or glass processing.

Education Requirements

MS in Optics/Photonics Engineering, Materials Science & Engineering (related to Photonics), Applied Physics, Chemical Engineering, or a related field with 3+ years post-degree experience; OR PhD in a related field with 1+ years post-degree experience. (These degree and years-of-experience requirements are the stated minimum qualifications.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.