Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Join the Advanced Packaging Mechanical Analysis team to develop multiphysics thermo-mechanical simulations that support design, development, and qualification of advanced semiconductor packages for Intel Foundry.

This role works cross-functionally with design, technology integration, reliability, yield, and manufacturing teams and requires regular onsite presence in Phoenix, AZ.

Experience Level

Mid-level — the role expects experienced engineers (documented minimum experience: 3+ years in relevant thermal-mechanical and FEA work).

Responsibilities

Primary responsibilities focus on simulation, experiment planning, and cross-functional technical support:

• Develop and validate finite element (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages (stress, strain, warpage, delamination, thermal cycling).
• Perform simulations and analyze reliability risk across a range of package architectures; provide actionable design and process recommendations.
• Design, coordinate and interpret laboratory experiments and materials characterization to understand material behavior and failure mechanisms.
• Collaborate with internal and external stakeholders to plan, execute, and communicate development activities and qualification programs.
• Combine experimental and numerical methods, and apply advanced analysis (statistical, AI/ML) where appropriate to supplement modeling.

Requirements

Must-have technical skills and experience; preferred skills listed separately.

• 3+ years thermal-mechanical work or research experience with emphasis on silicon reliability.
• 3+ years experience using finite element analysis tools.
• 3+ years experience with experimental materials characterization metrologies (e.g., DMA/TMA, nano-indentation).
• Ability to integrate experiments and simulations and to communicate results to cross-functional teams.
• Strong problem-solving and technical communication skills.

Nice-to-have:

• Multi-physics simulation experience (coupled electro-thermal-mechanical, two-phase flows, electroplating, plasma).
• Experience with optical co-packaging (optical coupling, fiber pigtail, free-space optics).
• Scripting or automation for simulation workflows (Python, TCL, MATLAB) and familiarity with AI/ML tooling.
• Knowledge of advanced packaging processes (die attach, underfill, molding, bumping, surface mount, reflow) and foundry experience.

Education Requirements

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, or a related field with emphasis in solid mechanics is listed as the minimum qualification.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.