Package Health Yield Engineer, APTD (Senior/Staff/Principal)

Job Title

Package Health Yield Engineer, APTD (Senior/Staff/Principal)

Role Summary

Work within Advanced Packaging Technology Development (APTD) to develop and execute package health monitoring, simulation, and characterization activities for high-performance memory packages. The role is hands-on and focuses on design-for-test (DFT), data analysis, electrical characterization, and reliability testing to improve test coverage and yield.

Experience Level

Senior level (title indicates Senior/Staff/Principal). The posting lists a minimum of 2+ years semiconductor industry experience; candidates are expected to have demonstrated experience in packaging or test engineering.

Responsibilities

The engineer will own test architecture and coverage activities, contribute to test vehicle validations, and support probe and product yield improvements.

• Develop test architecture, coverage strategies, and yield-focused approaches for advanced packages.
• Define, validate, and optimize test coverage for wafer- and die-level processes.
• Perform electrical characterization and failure analysis of advanced packages (including HBM).
• Identify needs and co-develop new DFTs with cross-functional teams.
• Enhance debug capabilities to meet probe-yield targets and reduce escapes.
• Contribute test architecture inputs to the APTD product roadmap and test vehicle (TV) readiness.
• Coordinate customer test-flow readiness activities with external partners.

Requirements

Key must-have skills and experience; items listed as beneficial where noted.

• Minimum 2+ years experience in the semiconductor industry working on product, packaging, or test engineering (must-have).
• Experience defining test architectures, coverage planning, and managing test/probe yield (must-have).
• Strong knowledge of product testing, packaging failure modes, and test methodologies (must-have).
• Hands-on experience with simulation tools, test equipment, package characterization, and electrical failure analysis (must-have).
• Proficiency in data analysis, statistics, and scripting (examples: Python, MATLAB, JMP) and familiarity with AI/ML tools for data-driven diagnostics (must-have).
• Proven problem-solving, debugging, and multitasking skills; effective written and verbal communication (must-have).
• Experience with high-bandwidth memory (HBM) packages and customer-facing test-flow coordination (preferred).

Education Requirements

Bachelor's or Master's degree in Electrical Engineering or a related field is required (as stated). The posting specifies degrees in Electrical Engineering or related disciplines; no alternative "equivalent experience" language was provided.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.