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Package Failure Analysis Engineer

Intel Corporation
July 09, 2026
Full-time
On-site
Phoenix, Arizona, United States
$85,200 - $139,810 USD yearly
Test Engineering Jobs, Level - Entry or Early Career

Job Title

Package Failure Analysis Engineer

Role Summary

Lab-based engineer responsible for root-cause determination of assembled package yield loss and in-line failures. Works on a back-of-week compressed shift to perform hands-on failure analysis, electrical fault isolation, defect characterization, and process characterization to support yield and program deliverables.

Collaborates with technicians, shift engineers, yield/integration teams and program customers to align priorities, share technical findings, and recommend corrective actions.

Experience Level

Entry-level / College graduate. Suitable for new graduates or engineers with early-career experience (approximately 0–3 years).

Responsibilities

Primary responsibilities include hands-on analysis, cross-team support, and technical reporting.

  • Perform hands-on lab work to isolate electrical failures and characterize defects and processes.
  • Define data acquisition and analysis plans; interpret results and recommend corrective actions.
  • Develop and refine failure analysis techniques, best-known-methods (BKMs), and approaches to accelerate root-cause identification.
  • Interface with internal teams (yield, integration, module partners, customers) to meet program milestones and improve yield.
  • Respond to customer requests and events as they occur; provide consultation on packaging/assembly issues.
  • Work across organizational boundaries and shifts to support continuous coverage and handoff.
  • Communicate findings verbally and via written reports to engineers and stakeholders.

Requirements

Must-have qualifications, clearance, skills, and working conditions.

  • US Citizenship required.
  • Ability to obtain and maintain a US Government TS/SCI security clearance with polygraph.
  • Hands-on experience with one or more electrical fault isolation or defect characterization techniques.
  • Comfortable working in a lab environment; able to operate and learn lab equipment and procedures.
  • Strong analytical and problem-solving skills, with clear verbal and written communication.
  • Ability to work effectively across teams and adapt to changing priorities and ambiguous situations.
  • Shift 7 schedule required: back-half-of-week coverage (AM–PM Thurs–Sat) with alternating Wednesday day shifts.
  • Preferred: familiarity with CAD and basic statistical analysis tools (e.g., JMP).
  • Preferred: ability to present findings to yield engineers, LYA analysts, and other customers.

Education Requirements

Bachelor's degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-07-08