Package Failure Analysis Engineer

Job Title

Package Failure Analysis Engineer

Role Summary

As a Manufacturing Failure Analysis Engineer you will identify and investigate component and assembly failures to improve yield, reliability, and performance of advanced silicon packaging. You will perform root-cause analysis, produce technical reports, and work with cross-functional teams to implement corrective actions and drive continuous improvement in manufacturing processes.

Experience Level

Mid-level (Experienced hire). Years of experience: Not specified.

Responsibilities

Core responsibilities include analyzing failed parts, developing failure-analysis strategies, and supporting product transfers into manufacturing.

• Perform electrical validation and fault isolation for failed products and identify physical defects linked to electrical failures.
• Evaluate assembly, fabrication, substrate processes, and material characteristics to determine failure modes and mechanisms.
• Use analytical instruments (Parametric Analyzer / I-V, Keithley meters, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic and IR imaging) for root-cause investigations.
• Develop and implement failure-analysis methodologies for new and complex manufacturing issues.
• Produce technical reports documenting failure mechanisms, root causes, and recommended corrective actions.
• Support new technology and product transfers and disseminate best-known methods across sites.
• Drive improvements in analytical techniques and metrology for quality and reliability applications.
• Collaborate with cross-functional teams to review failure data and recommend process or design changes.

Requirements

Required technical skills and experience; preferred items listed separately.

• Must-have: Hands-on experience in fault isolation, defect detection, and failure analysis in manufacturing or research environments.
• Must-have: Proficiency operating analytical tools such as Parametric Analyzer (I/V), TDR, SEM/EDX, FIB, FTIR, X-Ray, and acoustic/IR imaging systems.
• Must-have: Technical understanding of material properties and device interactions relevant to package-level failures.
• Must-have: Strong problem-solving and data-analysis skills; ability to draw actionable conclusions from complex datasets.
• Nice-to-have: Experience with additional material analysis techniques such as XPS or ToF-SIMS.
• Nice-to-have: Experience developing new failure-analysis methodologies and publishing technical reports.
• Nice-to-have: Strong written and verbal communication skills and experience working in cross-functional manufacturing teams.

Education Requirements

Minimum: Bachelor's degree in Engineering, Physics, Chemistry, or a related technical field. Preferred: Master's degree in Engineering, Physics, Chemistry, or related fields.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.