Package Design Engineer

Job Title

Package Design Engineer

Role Summary

Design and deliver advanced semiconductor packaging solutions (2.5D/3D, chiplet, FCBGA, SiP, WLCSP, wire bond, QFP/QFN) for automotive, industrial IoT, and AI platforms. Work on package layout execution, manufacturability, and cross-domain co-design with silicon, SI/PI, thermal, and reliability teams.

Experience Level

Mid-level. The posting requests 4+ years of hands-on experience; generally aligned with a 3–7 year mid-career range.

Responsibilities

Execute detailed package design and coordinate with manufacturing and cross-functional teams throughout the design cycle.

• Execute package layout design for advanced packages including 2.5D/3D IC, FCBGA, SiP, WLCSP, and multi-chip modules.
• Develop and maintain package CAD databases and ensure adherence to design guidelines, DFM, and DFA for manufacturability and yield.
• Manage the full design cycle: schematic capture, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Collaborate with SI/PI, thermal, reliability, and DFT teams; participate in design reviews and co-optimization activities.
• Ensure designs comply with foundry and OSAT manufacturing design rules (DRC, LVS).
• Support ECO cycles, design updates, and version control throughout projects.

Requirements

Must-have technical skills, tools experience, and applied manufacturing knowledge.

• 4+ years of hands-on experience in package CAD layout and development.
• Practical experience with 2.5D/3D IC packaging, FCBGA, advanced substrate-based packages, and multi-die/chiplet designs.
• High proficiency with tools such as Cadence Allegro Package Designer (APD/SiP), Siemens Xpedition/Substrate Integrator, or equivalent.
• Experience working with advanced manufacturing design rules and interfacing directly with Tier-1 OSATs and foundries.
• Solid understanding of SI and PI fundamentals, high-speed routing, impedance control, and crosstalk mitigation.
• Strong written and verbal communication, presentation, and documentation skills; experience in global, cross-functional teams.
• Nice-to-have: experience with thermal and reliability co-design, scripting/automation for CAD flows, and exposure to DFT practices.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.