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NMSI F11X Dry Etch Module Engineer-Technologist

Intel Corporation
September 25, 2026
Full-time
On-site
Albuquerque, New Mexico, United States
$140,830 - $231,670 USD yearly
Process Engineering Jobs, Level - Mid-Career

Job Title

NMSI F11X Dry Etch Module Engineer-Technologist

Role Summary

Lead development and enablement of dry etch processes and related equipment for both high-volume manufacturing (HVM) and future product technologies. Work spans process integration, equipment engineering, metrology, and system design to meet device performance and manufacturability targets.

Experience Level

Mid-level. See Education Requirements for specific degree and years guidance.

Responsibilities

Deliver technical solutions for dry etch process development and manufacturing; support technology roadmaps and transfers to production.

  • Develop and optimize dry etch processes, including material selection and process parameter tuning.
  • Design and implement metrology and process control strategies to meet device and yield targets.
  • Provide equipment engineering input and collaborate on system design and integration.
  • Lead feasibility/pathfinding studies for next-generation architectures and process technologies.
  • Partner with cross-functional teams to enable product transfers to HVM and improve operational performance.
  • Identify and implement equipment and process improvements to increase throughput, yield, and efficiency.
  • Coordinate with equipment suppliers and internal stakeholders during development and implementation.

Requirements

Core technical and industry experience required for successful performance in the role.

  • Proven experience in dry etch process development for semiconductor manufacturing.
  • Experience collaborating with equipment suppliers on process optimization, development, and implementation.
  • Hands-on skills in process integration, equipment engineering, metrology, and process parameter optimization.
  • Experience supporting technology transfer to high-volume manufacturing and improving manufacturing efficiency.
  • Strong cross-functional collaboration and technical leadership skills.

Nice-to-have:

  • Experience in TSV etch process development.
  • Experience with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
  • Experience supporting semiconductor fab startups and foundry environments.
  • Track record of publications or patents related to dry etch technologies.

Education Requirements

Minimum: Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field with 6+ years of semiconductor industry experience (dry etch focus), or a Bachelor’s in those fields with 9+ years of semiconductor industry experience. Preferred: Ph.D. in a related STEM field with publications and/or patents and 5+ years industry experience. "Related STEM field" acceptable as stated in the posting.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-09-22