MTS 3D Heterogenous Integration Engineer

Job Title

MTS 3D Heterogenous Integration Engineer

Role Summary

Join the Advanced Packaging Lab (APL) at GlobalFoundries Fab8 as an R&D engineer to lead development of 3D Heterogeneous Integration (3D-HI) technologies such as wafer-to-wafer and die-to-wafer hybrid bonding, TSV/TOV, and interposer development. The role focuses on process development, integration, prototyping, and collaboration with internal teams and external vendors/partners.

Experience Level

Mid-level: typical candidate has approximately 5–6 years of related industry experience (guidance from employer). PhD candidates with 3–4 years of related experience are noted as preferred in the posting.

Responsibilities

Lead and deliver process development and integration for advanced packaging building blocks, work cross-functionally, and enable early product prototyping.

• Drive 3D-HI process development for multi-die stacking, fine-pitch hybrid bonding, TSV/TOV, and interposer technologies.
• Partner with unit process and manufacturing engineers, tool and material vendors, and OSAT partners.
• Collaborate on joint development projects to develop wafer- and die-level 2.5D/3D processes.
• Plan and execute end-to-end process integration to enable new capabilities and early prototypes across programs.
• Develop and apply expertise in processes, materials, tooling, and characterization methods.
• Perform data analysis, interpret results, identify failure modes, and resolve process integration issues using DOE and other techniques.
• Generate intellectual property related to wafer integration and packaging technology.
• Participate in hiring activities, mentor new hires, and perform other duties as assigned.
• Conduct all work in compliance with Environmental, Health, Safety & Security requirements.

Requirements

Key technical and professional requirements. Preferred items are listed separately.

Must-have:

• Approximately 5–6 years of related experience (typical for MS-level candidates).
• In-depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem-solving and technical troubleshooting skills, including experience designing and analyzing experiments (DOE).
• Experience with data analysis, failure-mode analysis, and process integration planning.
• English fluency (written and verbal) and ability to travel up to 20%.

Nice-to-have:

• Demonstrated leadership experience with internal teams or within an OSAT ecosystem.
• Project management skills, strong written and verbal communication, and strong planning and organizational skills.

Education Requirements

Master's degree required: MS in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related technical field (from an accredited program). Employer guidance expects an MS-level candidate with ~5–6 years of related experience. PhD preferred (with ~3–4 years relevant experience). Posting specifies a minimum overall GPA of 3.0. No specific certifications were listed; equivalent practical experience was not stated.

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About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.