Module Development Engineer, Defect Inspection

Job Title

Module Development Engineer, Defect Inspection

Role Summary

Develop, optimize, and scale defect inspection and metrology solutions for semiconductor advanced packaging to support current high-volume manufacturing and future technology nodes. Work with cross-functional engineering teams, suppliers, and research partners to improve inspection capability, drive yield, and influence process and equipment choices.

Experience Level

Mid-level. Typical experience expectations: Bachelor's degree +4 years, Master's degree +3 years, or PhD +2 years of relevant experience.

Responsibilities

Key responsibilities include development, deployment, and continuous improvement of defect inspection methods and systems.

• Develop and implement defect inspection and metrology processes for semiconductor manufacturing.
• Design and optimize inspection methods and equipment performance.
• Plan and execute process experiments and feasibility studies using DOE and SPC.
• Analyze defect and yield data to identify root causes and corrective actions.
• Collaborate with equipment and materials suppliers to introduce and qualify new technologies.
• Drive automation and software/hardware enhancements for inspection systems.
• Support technology pathfinding and roadmap activities for next-generation products.
• Transfer qualified inspection solutions into high-volume manufacturing and support ongoing HVM needs.

Requirements

Must-have technical skills and experience (degree specifics are listed in Education Requirements below).

• Experience in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Practical knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE).
• Hands-on experience with defect analysis, root-cause investigation, and yield improvement.
• Experience developing or optimizing inspection/metrology equipment, methods, or workflows.
• Familiarity with automation, data analysis tools, and software integration for inspection systems.
• Strong collaboration and communication skills across engineering and supplier teams.

Nice-to-have / preferred

• Demonstrated ability to troubleshoot manufacturing equipment and processes.
• Experience with advanced packaging processes, equipment automation development, or project management in technology development.
• Previous work experience in a semiconductor foundry or high-volume manufacturing environment.

Education Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with at least 4 years of relevant experience; OR Master's degree in those fields with 3+ years of experience; OR PhD in those fields with 2+ years of experience. Fields listed above are explicitly referenced in the posting. No certifications were specified.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.