Module Development Engineer

Job Title

Module Development Engineer

Role Summary

As a Module Development Engineer within Intel Foundry, you will develop and enable manufacturing processes for wafer-level assembly and advanced packaging to meet product performance, yield, and reliability targets. The role spans process development, equipment optimization, and materials integration and requires cross-functional coordination with operations, yield, and supplier teams.

Experience Level

Mid-level — typical candidate profile: PhD plus 61 year of relevant experience, or Masters plus 64 years of relevant experience in semiconductor process or packaging development.

Responsibilities

Primary responsibilities include leading process development and enabling scalable manufacturing solutions.

• Lead design and development of manufacturing processes, including material selection and parameter optimization.
• Drive technology enablement for high-volume manufacturing and for future device architectures.
• Perform feasibility studies using simulation and engineering methods to meet device specifications.
• Conduct pathfinding and prototype activities to develop innovative process solutions.
• Develop and implement technology roadmaps to guide manufacturing needs.
• Collaborate with equipment and material suppliers to implement enabling technologies.
• Optimize production efficiency and manufacturing techniques for new and existing products.
• Use statistical process control and data analytics to improve process stability and yield.
• Recommend and implement equipment or process modifications to improve scalability.
• Partner with cross-functional teams to align on process integration and project deliverables.

Requirements

Must-have technical experience and capabilities; preferred items summarized separately.

• Hands-on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
• Experience with manufacturing process development, process improvement, and production scaling.
• Proficiency in statistical process control and data-driven process optimization.
• Familiarity with equipment metrology and parameter optimization.
• Strong problem-solving skills and demonstrated ability to work with cross-functional teams and suppliers.

Preferred:

• Experience with epoxy, mold materials, annealing, hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
• Proven ability to lead programs from strategy through high-volume production.
• Experience developing design rules for manufacturability and reliability.

Education Requirements

PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 61 year of relevant experience; OR Masters in those fields with 64 years of relevant experience. Qualifications may also be demonstrated via a combination of industry experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.