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Internship - R&D CMOS Integration

GlobalFoundries
March 26, 2026
Internship
On-site
Dresden, Saxony, Germany
Level - Entry or Early Career

Role Summary

This internship offers students the opportunity to work closely with the Technology Architect Group at GlobalFoundries on early-stage research and exploratory technology development, focusing on CMOS technologies.

Experience Level

Entry-level internship, suitable for students currently enrolled in relevant fields of study.

Responsibilities

Key responsibilities include:

  • Supporting experimental development of HfO₂-based ferroelectric memory devices.
  • Assisting in material- and device-level characterization.
  • Processing and analyzing electrical, thermal, and reliability datasets.
  • Evaluating integration pathways into 22FDX® FDSOI CMOS flows.
  • Assisting in the development of AI/ML approaches for device variability analysis.
  • Research on AI-assisted pattern recognition and automated data labeling.
  • Preparing technical documentation and experiment reports.
  • Participating in cross-functional meetings.

Requirements

Successful candidates should have:

  • Enrollment in Electrical Engineering, Electronics, Semiconductor Devices, Computer Engineering, or a similar field.
  • Foundational knowledge in semiconductors and microelectronics.
  • Strong analytical and problem-solving skills.
  • Excellent English communication skills (C1).
  • Ability to work independently in a research-focused environment.

Education Requirements

Enrollment in a relevant university program is required. Specific degrees may include Electrical Engineering, Computer Engineering, or related fields.


About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

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Date Posted: 2026-03-26